JPH0543485Y2 - - Google Patents

Info

Publication number
JPH0543485Y2
JPH0543485Y2 JP1987059805U JP5980587U JPH0543485Y2 JP H0543485 Y2 JPH0543485 Y2 JP H0543485Y2 JP 1987059805 U JP1987059805 U JP 1987059805U JP 5980587 U JP5980587 U JP 5980587U JP H0543485 Y2 JPH0543485 Y2 JP H0543485Y2
Authority
JP
Japan
Prior art keywords
wiring board
flip chip
bumps
conductor
flip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987059805U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63165855U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987059805U priority Critical patent/JPH0543485Y2/ja
Publication of JPS63165855U publication Critical patent/JPS63165855U/ja
Application granted granted Critical
Publication of JPH0543485Y2 publication Critical patent/JPH0543485Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H01L2224/141—Disposition
    • H01L2224/1418—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/14181—On opposite sides of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987059805U 1987-04-20 1987-04-20 Expired - Lifetime JPH0543485Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987059805U JPH0543485Y2 (en]) 1987-04-20 1987-04-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987059805U JPH0543485Y2 (en]) 1987-04-20 1987-04-20

Publications (2)

Publication Number Publication Date
JPS63165855U JPS63165855U (en]) 1988-10-28
JPH0543485Y2 true JPH0543485Y2 (en]) 1993-11-02

Family

ID=30891644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987059805U Expired - Lifetime JPH0543485Y2 (en]) 1987-04-20 1987-04-20

Country Status (1)

Country Link
JP (1) JPH0543485Y2 (en])

Also Published As

Publication number Publication date
JPS63165855U (en]) 1988-10-28

Similar Documents

Publication Publication Date Title
US6920688B2 (en) Method for a semiconductor assembly having a semiconductor die with dual heat spreaders
KR100368698B1 (ko) 반도체패키지와,그것을이용한반도체장치및그제조방법
US6744122B1 (en) Semiconductor device, method of manufacture thereof, circuit board, and electronic device
US5561323A (en) Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
US5633533A (en) Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
JP3238004B2 (ja) 半導体装置の製造方法
JP2816028B2 (ja) 半導体装置の製造方法
US20050161793A1 (en) Semiconductor device and stacked semiconductor device that can increase flexibility in designing a stacked semiconductor device
JPH0543485Y2 (en])
KR940027134A (ko) 반도체집적회로장치의 제조방법
JPS6220707B2 (en])
JP3332555B2 (ja) 半導体装置およびその製造方法
JP2000232182A (ja) Ｂｇａ構造の半導体装置及びその製造方法
JPH0433137B2 (en])
JPH0228261B2 (en])
JP3883531B2 (ja) 半導体装置
JP3841135B2 (ja) 半導体装置、回路基板及び電子機器
JP3295987B2 (ja) 半導体装置の製造方法
JP2975782B2 (ja) 混成集積回路装置およびこれに用いるケース材
JP3096510B2 (ja) 混成集積回路装置
JP2752286B2 (ja) 混成集積回路装置
JP4528977B2 (ja) 半導体装置の製造方法
JPH0451488Y2 (en])
JPS59145534A (ja) 半導体デバイスの封止方法
JPH1022329A (ja) 半導体装置